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COMPONENT MANUFACTURING Components such as Resistor s, Capacitor s and Integrated Circuit s are generally made by specialized contractors. Integrated circuits are generally made by the process of Photolithography PRINTED CIRCUIT BOARD MANUFACTURING Printed circuit boards ( PCB s) are usually manufactured by specialized contractors. SURFACE-MOUNT DEVICE COMPONENTS MOUNTING Surface-mount device ( SMD ) components can be Hand-soldered , but usually they are placed using Surface-mount Technology (SMT). The process usually consists of 3 steps: # Solder Paste Print # SMT placement, using a "pick and place" machine # Reflow Oven The process is repeated twice in order to populate both sides of the PCB . THROUGH-HOLE COMPONENTS MOUNTING There are 3 methods for mounting Through-hole components and Connector s: DEPANEL In order to increase PCB and SMT capacity, several boards are Panelized into one large multiblock. They are Depanel ed at a certain stage in the process, which might be before SMT , after SMT or just before final Case-up . CASE-UP The Case-up process consists of one or more of the following:
CLEANING A completed PCA needs to be "cleaned", using various techniques depending on what type of solder and flux was used. DRYING A clean wet board needs to be "dried" before the power can be inspected or electrically activate. TESTING Electronic assemblies are tested at various process steps using following methods:
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