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processor.]] In Microelectronics , a dual in-line package (DIP), sometimes called a '''DIL''' package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, usually protruding from the longer sides of the package and bent downward. A DIP is usually referred to as a '''DIP''n''''', where ''n'' is the total number of pins. DIPs may be used for Integrated Circuit s (ICs, "chips"), like Microprocessor s, or for arrays of discrete components such as resistors or toggle switches. They can be mounted on a Printed Circuit Board (PCB) either directly using Through-hole Technology , or using inexpensive sockets to allow for easy replacement of the device. A typical DIP may be a microcircuit package with two rows of seven vertical leads (i.e., a DIP14). The most common DIPs have an inter-lead spacing (lead pitch) of 0.1 " (2.54 Mm ) and a row spacing of either 0.3" (7.62 mm) or 0.6" (15.24 mm). Typical pin counts are 8 or any even number from 14 to 24 (less common 28) for 0.3" packages, and 24, 28, 32 or 40 (less common 36, 48 or 52) for 0.6" packages. JEDEC -standards also specify less common packages with a row spacing of 0.4" (10.16 mm), or 0.9" (22.86 mm) with a pin-count of up to 64. Other standardized variants include a lead pitch of 0.07" (1.778 mm) at a row spacing of 0.3", 0.6" or 0.75". Several DIP variants exist, mostly distinguished by packaging material:
DIPs were the mainstream of the microelectronics industry in the 1970s and 80s. Their use has subsided in recent years due to the emerging new Surface-mount Technology (SMT) packages such as PLCC and SOIC . For programmable devices like EPROM s and GAL s, DIPs remained popular for many years due to their easy handling with external programming circuitry. However, with In-System Programming (ISP) technology now state of the art, this advantage of DIPs is rapidly losing importance as well. SEE ALSO SOURCES
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