Information About

Multi-chip Module

MCMs are classified according to the technology used to create the HDI (High Density Interconnection) substrate.

MCM-L - laminated MCM. The substrate is a multi-layer laminated PCB ( Printed Circuit Board ).

MCM-D - deposited MCM. The modules are deposited on the base substrate using thin film technology.

MCM-C - ceramic substrate MCMs.

See also System In Package

List of MCMs

IBM Bubble Memory MCMs (1970s)

Dempsey and Clovertown

Sony Memory Stick s

"Multi Chip Modules" at CMAC